Sr Principal Engineer Microelectronic Semiconductors with Security Clearance

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Job description

Requisition ID: R Category: Engineering Location: Apopka, Florida, United States of America Clearance Type: Secret Telecommute: No- Teleworking not available for this position Shift: 1st Shift (United States of America) Travel Required: Yes, 10% of the Time Relocation Assistance: Relocation assistance may be available Positions Available: 1At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. External/Internal Description Northrop Grumman Mission Systems is seeking a Sr Principal Semiconductor Equipment Engineer for our Advanced Packaging Technology Fab - located in Apopka, Florida. Northrop Grumman's semiconductor foundry and packaging lines have unique capabilities to support a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide) and provide leading-edge technology development. The wafer bumping line will support flip chip, 2.5D, and 3D packaging for internal production customers as well as emerging technology programs. The line will provide a range of bump compositions, including tin/lead, lead-free, micro bumps, and copper pillar, using sputter, electro, and electro-less plating, and solder-sphere transfer to support flip chip, 2.5D, and 3D packaging. The Semiconductor Equipment Engineer will lead and manage engineering projects such as equipment layout, cleanroom construction, and installation of semiconductor equipment. Responsibilities include all aspects of facilities and factory layout for foundry equipment. The chosen candidate will develop and apply continuous improvement programs and be responsible for all aspects of project management including working with and directing contractors/sub-contractors along with alignment with management. May be responsible for running a group or groups of tools, from day-to-day maintenance/preventative maintenance operations (i.e. chemical management) up to and including service contracts with vendors. Minimal travel - one to three short trips per year. Basic Qualifications: Must have a bachelor's degree in a technical area with 9 years of relevant experience (7 years with a technical MS; or 4 years with a PhD,12 years of experience required with a technical Associate of Science) Minimum of 5-3 years of experience working with semiconductor fabrication equipment or the construction industry Also requires experience with semiconductor wafer fabrication facilities and operation Experience with fab facility, equipment installation, and maintenance. Demonstrated ability to work with cross-organizational teams such as engineering, line maintenance, and building maintenance Strong leadership and communication skills. Must be a US Citizen and able to obtain and maintain a Secret clearance
Preferred Qualifications: Experience with semiconductor clean room design and construction. Experience with Architecture and Engineering ("A&E") drawing sets Experience with AutoCAD design Proven track record managing strategic projects from inception through completion; including financial, risk, and schedule management Experience in low volume/high product mix environments Experience interfacing with vendors for equipment repairs, service contracts, and purchase-preferred Personal Clearance Level- Secret
MANUMS
Salary Range: $114,900 - $172,300
The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.
Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.

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