Wafer Process and Yield Improvement Engineer with Security Clearance

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Job description

General Description:
We are seeking a yield improvement and failure analysis engineer for a high mix and low volume fab. The candidate should have 2+ years of experience in yield engineering, device failure analysis, semiconductor process development, wafer fabrication, materials characterization, or data analysis. Essential Duties:
The role requires understanding of at least one semiconductor process module (PHOTO, DRY ETCH, WET ETCH, METROLOGY, THIN FILM, CVD, CMP, TEST, and PACKAGING). The individual will work with integration, production, and process engineers to find root cause of device failures, implement process improvement plans, create design of experiment (DOE) using JMP, and report findings to department and program staff. The engineer will perform materials characterization at HRL and also help coordinate sample analysis at external characterization labs. The role requires Required Skills:
Materials characterization including SEM, FIB, TEM
Cleanroom experience
Understanding of semiconductor processes
Attention to detail and excellent verbal and written communications. Required Education:
B.S. degree in Electrical Engineering, Physics, Chemistry, Materials Science, or a STEM related field plus 2+ years of work experience or graduate education. Physical Requirements:
Must be willing to work in a cleanroom (up to 30%) Special Requirements:
U.S. Citizenship.
Must have or be willing to apply for a security clearance. Compensation:
The base salary range for this full-time position is $99,705 - $124,683 + bonus + benefits. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.

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